In-situ protective film

ABSTRACT

An apparatus according to one embodiment includes a magnetic read transducer comprised of a sensing portion and proximate magnetic shields, and a wear-resistant in-situ film on a media-facing side of the read transducer. The in-situ film is comprised of material derived from a flexible medium. The in-situ film is primarily above the read transducer. A method according to one embodiment includes forming a wear-resistant in-situ film on a magnetic read transducer having a sensor with magnetic shields. The in-situ film including material derived from a flexible medium. The material is formed on the transducer by passing the flexible medium over the transducer at an elevated temperature.

BACKGROUND

The present invention relates to data storage systems, and moreparticularly, this invention relates to wear-resistant in-situ films formagnetic read transducers.

In magnetic storage systems, magnetic transducers read data from andwrite data onto magnetic recording media. Data is written on themagnetic recording media by moving a magnetic recording transducer to aposition over the media where the data is to be stored. The magneticrecording transducer then generates a magnetic field, which encodes thedata into the magnetic media. Data is read from the media by similarlypositioning the magnetic read transducer and then sensing the magneticfield of the magnetic media. Read and write operations may beindependently synchronized with the movement of the media to ensure thatthe data can be read from and written to the desired location on themedia.

An important and continuing goal in the data storage industry is that ofincreasing the density of data stored on a medium. For tape storagesystems, that goal has led to increasing the track and linear bitdensity on recording tape, and decreasing the thickness of the magnetictape medium. However, the development of small footprint, higherperformance tape drive systems has created various problems in thedesign of a tape head assembly for use in such systems.

In a tape drive system, the drive moves the magnetic tape over thesurface of the tape head at high speed. Usually the tape head isdesigned to minimize the spacing between the head and the tape. Thespacing between the magnetic head and the magnetic tape is crucial andso goals in these systems are to have the recording gaps of thetransducers, which are the source of the magnetic recording flux in nearcontact with the tape to effect writing sharp transitions, and to havethe read elements in near contact with the tape to provide effectivecoupling of the magnetic field from the tape to the read elements.

SUMMARY

An apparatus according to one embodiment includes a magnetic readtransducer comprised of a sensing portion and proximate magneticshields, and a wear-resistant in-situ film on a media-facing side of theread transducer. The in-situ film is comprised of material derived froma flexible medium. The in-situ film is primarily above the readtransducer.

A method according to one embodiment includes forming a wear-resistantin-situ film on a magnetic read transducer having a sensor with magneticshields. The in-situ film including material derived from a flexiblemedium. The material is formed on the transducer by passing the flexiblemedium over the transducer at an elevated temperature.

A method according to another embodiment includes determiningresistances of read transducers, and comparing the determinedresistances to previously-stored resistance values. In response todetermining that the measured resistances have significantly changedfrom the previously-stored resistance values, the read transducers arecaused heated to above a normal operation temperature, and a flexiblemedium is run over the transducers for forming a wear-resistant in-situfilm om the read transducers.

Any of these embodiments may be implemented in a magnetic data storagesystem such as a tape drive system, which may include a magnetic head, adrive mechanism for passing a flexible medium (e.g., recording tape)over the magnetic head, and a controller electrically coupled to themagnetic head.

Other aspects and embodiments of the present invention will becomeapparent from the following detailed description, which, when taken inconjunction with the drawings, illustrate by way of example theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram of a simplified tape drive systemaccording to one embodiment.

FIG. 1B is a schematic diagram of a tape cartridge according to oneembodiment.

FIG. 2 illustrates a side view of a flat-lapped, bi-directional,two-module magnetic tape head according to one embodiment.

FIG. 2A is a tape bearing surface view taken from Line 2A of FIG. 2.

FIG. 2B is a detailed view taken from Circle 2B of FIG. 2A.

FIG. 2C is a detailed view of a partial tape bearing surface of a pairof modules.

FIG. 3 is a partial tape bearing surface view of a magnetic head havinga write-read-write configuration.

FIG. 4 is a partial tape bearing surface view of a magnetic head havinga read-write-read configuration.

FIG. 5 is a side view of a magnetic tape head with three modulesaccording to one embodiment where the modules all generally lie alongabout parallel planes.

FIG. 6 is a side view of a magnetic tape head with three modules in atangent (angled) configuration.

FIG. 7 is a side view of a magnetic tape head with three modules in anoverwrap configuration.

FIG. 8 is a side view of a magnetic tape head according to oneembodiment.

FIG. 9 is a side view of a magnetic tape head according to oneembodiment.

FIG. 10 is a side view of a magnetic tape head according to oneembodiment.

FIG. 11 is a flow chart of a method according to one embodiment.

FIGS. 12A-12B are AFM images of a transducer having an in-situ filmformed with a current of 5 mA.

FIGS. 13A-13B are AFM images of a transducer having an in-situ filmformed with a current of 7 mA.

FIG. 14 is a flow chart of a method according to one embodiment.

DETAILED DESCRIPTION

The following description is made for the purpose of illustrating thegeneral principles of the present invention and is not meant to limitthe inventive concepts claimed herein. Further, particular featuresdescribed herein can be used in combination with other describedfeatures in each of the various possible combinations and permutations.

Unless otherwise specifically defined herein, all terms are to be giventheir broadest possible interpretation including meanings implied fromthe specification as well as meanings understood by those skilled in theart and/or as defined in dictionaries, treatises, etc.

It must also be noted that, as used in the specification and theappended claims, the singular forms “a,” “an” and “the” include pluralreferents unless otherwise specified.

The following description discloses several preferred embodiments ofmagnetic storage systems, as well as operation and/or component partsthereof.

In one general embodiment, an apparatus includes a magnetic readtransducer comprised of a sensing portion and proximate magneticshields, and a wear-resistant in-situ film on a media-facing side of theread transducer. The in-situ film is comprised of material derived froma flexible medium. The in-situ film is primarily above the readtransducer.

In another general embodiment, a method includes forming awear-resistant in-situ film on a magnetic read transducer having asensor with magnetic shields. The in-situ film including materialderived from a flexible medium. The material is formed on the transducerby passing the flexible medium over the transducer at an elevatedtemperature.

In yet another general embodiment, a method includes determiningresistances of read transducers, and comparing the measured resistancesto previously-stored resistance values. In response to determining thatthe determined resistances have significantly changed from thepreviously-stored resistance values, the read transducers are causedheated to above a normal operation temperature, and a flexible medium isrun over the transducers for forming a wear-resistant in-situ film omthe read transducers.

FIG. 1A illustrates a simplified tape drive 100 of a tape-based datastorage system, which may be employed in the context of the presentinvention. While one specific implementation of a tape drive is shown inFIG. 1A, it should be noted that the embodiments described herein may beimplemented in the context of any type of tape drive system.

As shown, a tape supply cartridge 120 and a take-up reel 121 areprovided to support a tape 122. One or more of the reels may form partof a removable cartridge and are not necessarily part of the system 100.The tape drive, such as that illustrated in FIG. 1A, may further includedrive motor(s) to drive the tape supply cartridge 120 and the take-upreel 121 to move the tape 122 over a tape head 126 of any type. Suchhead may include an array of readers, writers, or both.

Guides 125 guide the tape 122 across the tape head 126. Such tape head126 is in turn coupled to a controller 128 via a cable 130. Thecontroller 128, may be or include a processor and/or any logic forcontrolling any subsystem of the drive 100. For example, the controller128 typically controls head functions such as servo following, datawriting, data reading, etc. The controller 128 may include at least oneservo channel and at least one data channel, each of which include dataflow processing logic configured to process and/or store information tobe written to and/or read from the tape 122. The controller 128 mayoperate under logic known in the art, as well as any logic disclosedherein, and thus may be considered as a processor for any of thedescriptions of tape drives included herein, in various embodiments. Thecontroller 128 may be coupled to a memory 136 of any known type, whichmay store instructions executable by the controller 128. Moreover, thecontroller 128 may be configured and/or programmable to perform orcontrol some or all of the methodology presented herein. Thus, thecontroller 128 may be considered to be configured to perform variousoperations by way of logic programmed into one or more chips, modules,and/or blocks; software, firmware, and/or other instructions beingavailable to one or more processors; etc., and combinations thereof.

The cable 130 may include read/write circuits to transmit data to thehead 126 to be recorded on the tape 122 and to receive data read by thehead 126 from the tape 122. An actuator 132 controls position of thehead 126 relative to the tape 122.

An interface 134 may also be provided for communication between the tapedrive 100 and a host (internal or external) to send and receive the dataand for controlling the operation of the tape drive 100 andcommunicating the status of the tape drive 100 to the host, all as willbe understood by those of skill in the art.

FIG. 1B illustrates an exemplary tape cartridge 150 according to oneembodiment. Such tape cartridge 150 may be used with a system such asthat shown in FIG. 1A. As shown, the tape cartridge 150 includes ahousing 152, a tape 122 in the housing 152, and a nonvolatile memory 156coupled to the housing 152. In some approaches, the nonvolatile memory156 may be embedded inside the housing 152, as shown in FIG. 1B. In moreapproaches, the nonvolatile memory 156 may be attached to the inside oroutside of the housing 152 without modification of the housing 152. Forexample, the nonvolatile memory may be embedded in a self-adhesive label154. In one preferred embodiment, the nonvolatile memory 156 may be aFlash memory device, ROM device, etc., embedded into or coupled to theinside or outside of the tape cartridge 150. The nonvolatile memory isaccessible by the tape drive and the tape operating software (the driversoftware), and/or another device.

By way of example, FIG. 2 illustrates a side view of a flat-lapped,bi-directional, two-module magnetic tape head 200 which may beimplemented in the context of the present invention. As shown, the headincludes a pair of bases 202, each equipped with a module 204, and fixedat a small angle α with respect to each other. The bases may be“U-beams” that are adhesively coupled together. Each module 204 includesa substrate 204A and a closure 204B with a thin film portion, commonlyreferred to as a “gap” in which the readers and/or writers 206 areformed. In use, a tape 208 is moved over the modules 204 along a media(tape) bearing surface 209 in the manner shown for reading and writingdata on the tape 208 using the readers and writers. The wrap angle θ ofthe tape 208 at edges going onto and exiting the flat media supportsurfaces 209 are usually between about 0.1 degree and about 3 degrees.

The substrates 204A are typically constructed of a wear resistantmaterial, such as a ceramic. The closures 204B may be made of the sameor similar ceramic as the substrates 204A.

The readers and writers may be arranged in a piggyback or mergedconfiguration. An illustrative piggybacked configuration comprises a(magnetically inductive) writer transducer on top of (or below) a(magnetically shielded) reader transducer (e.g., a magnetoresistivereader, etc.), wherein the poles of the writer and the shields of thereader are generally separated. An illustrative merged configurationcomprises one reader shield in the same physical layer as one writerpole (hence, “merged”). The readers and writers may also be arranged inan interleaved configuration. Alternatively, each array of channels maybe readers or writers only. Any of these arrays may contain one or moreservo track readers for reading servo data on the medium.

FIG. 2A illustrates the tape bearing surface 209 of one of the modules204 taken from Line 2A of FIG. 2. A representative tape 208 is shown indashed lines. The module 204 is preferably long enough to be able tosupport the tape as the head steps between data bands.

In this example, the tape 208 includes 4 to 32 data bands, e.g., with 16data bands and 17 servo tracks 210, as shown in FIG. 2A on a one-halfinch wide tape 208. The data bands are defined between servo tracks 210.Each data band may include a number of data tracks, for example 1024data tracks (not shown). During read/write operations, the readersand/or writers 206 are positioned to specific track positions within oneof the data bands. Outer readers, sometimes called servo readers, readthe servo tracks 210. The servo signals are in turn used to keep thereaders and/or writers 206 aligned with a particular set of tracksduring the read/write operations.

FIG. 2B depicts a plurality of readers and/or writers 206 formed in agap 218 on the module 204 in Circle 2B of FIG. 2A. As shown, the arrayof readers and writers 206 includes, for example, 16 writers 214, 16readers 216 and two servo readers 212, though the number of elements mayvary. Illustrative embodiments include 8, 16, 32, 40, and 64 activereaders and/or writers 206 per array, and alternatively interleaveddesigns having odd numbers of reader or writers such as 17, 25, 33, etc.An illustrative embodiment includes 32 readers per array and/or 32writers per array, where the actual number of transducer elements couldbe greater, e.g., 33, 34, etc. This allows the tape to travel moreslowly, thereby reducing speed-induced tracking and mechanicaldifficulties and/or execute fewer “wraps” to fill or read the tape.While the readers and writers may be arranged in a piggybackconfiguration as shown in FIG. 2B, the readers 216 and writers 214 mayalso be arranged in an interleaved configuration. Alternatively, eacharray of readers and/or writers 206 may be readers or writers only, andthe arrays may contain one or more servo readers 212. As noted byconsidering FIGS. 2 and 2A-B together, each module 204 may include acomplementary set of readers and/or writers 206 for such things asbi-directional reading and writing, read-while-write capability,backward compatibility, etc.

FIG. 2C shows a partial tape bearing surface view of complementarymodules of a magnetic tape head 200 according to one embodiment. In thisembodiment, each module has a plurality of read/write (R/W) pairs in apiggyback configuration formed on a common substrate 204A and anoptional electrically insulative layer 236. The writers, exemplified bythe write transducer 214 and the readers, exemplified by the readtransducer 216, are aligned parallel to an intended direction of travelof a tape medium thereacross to form an R/W pair, exemplified by the R/Wpair 222. Note that the intended direction of tape travel is sometimesreferred to herein as the direction of tape travel, and such terms maybe used interchangeably. Such direction of tape travel may be inferredfrom the design of the system, e.g., by examining the guides; observingthe actual direction of tape travel relative to the reference point;etc. Moreover, in a system operable for bi-direction reading and/orwriting, the direction of tape travel in both directions is typicallyparallel and thus both directions may be considered equivalent to eachother.

Several R/W pairs 222 may be present, such as 8, 16, 32 pairs, etc. TheR/W pairs 222 as shown are linearly aligned in a direction generallyperpendicular to a direction of tape travel thereacross. However, thepairs may also be aligned diagonally, etc. Servo readers 212 arepositioned on the outside of the array of R/W pairs, the function ofwhich is well known.

Generally, the magnetic tape medium moves in either a forward or reversedirection as indicated by arrow 220. The magnetic tape medium and headassembly 200 operate in a transducing relationship in the mannerwell-known in the art. The piggybacked MR head assembly 200 includes twothin-film modules 224 and 226 of generally identical construction.

Modules 224 and 226 are joined together with a space present betweenclosures 204B thereof (partially shown) to form a single physical unitto provide read-while-write capability by activating the writer of theleading module and reader of the trailing module aligned with the writerof the leading module parallel to the direction of tape travel relativethereto. When a module 224, 226 of a piggyback head 200 is constructed,layers are formed in the gap 218 created above an electricallyconductive substrate 204A (partially shown), e.g., of AlTiC, ingenerally the following order for the R/W pairs 222: an insulating layer236, a first shield 232 typically of an iron alloy such as NiFe (—),cobalt zirconium tantalum (CZT) or Al—Fe—Si (Sendust), a sensor 234 forsensing a data track on a magnetic medium, a second shield 238 typicallyof a nickel-iron alloy (e.g., ˜80/20 at % NiFe, also known aspermalloy), first and second writer pole tips 228, 230, and a coil (notshown). The sensor may be of any known type, including those based onMR, GMR, AMR, tunneling magnetoresistance (TMR), etc.

The first and second writer poles 228, 230 may be fabricated from highmagnetic moment materials such as ˜45/55 NiFe. Note that these materialsare provided by way of example only, and other materials may be used.Additional layers such as insulation between the shields and/or poletips and an insulation layer surrounding the sensor may be present.Illustrative materials for the insulation include alumina and otheroxides, insulative polymers, etc.

The configuration of the tape head 126 according to one embodimentincludes multiple modules, preferably three or more. In awrite-read-write (W-R-W) head, outer modules for writing flank one ormore inner modules for reading. Referring to FIG. 3, depicting a W-R-Wconfiguration, the outer modules 252, 256 each include one or morearrays of writers 260. The inner module 254 of FIG. 3 includes one ormore arrays of readers 258 in a similar configuration. Variations of amulti-module head include a R-W-R head (FIG. 4), a R-R-W head, a W-W-Rhead, etc. In yet other variations, one or more of the modules may haveread/write pairs of transducers. Moreover, more than three modules maybe present. In further approaches, two outer modules may flank two ormore inner modules, e.g., in a W-R-R-W, a R-W-W-R arrangement, etc. Forsimplicity, a W-R-W head is used primarily herein to exemplifyembodiments of the present invention. One skilled in the art apprisedwith the teachings herein will appreciate how permutations of thepresent invention would apply to configurations other than a W-R-Wconfiguration.

FIG. 5 illustrates a magnetic head 126 according to one embodiment ofthe present invention that includes first, second and third modules 302,304, 306 each having a tape bearing surface 308, 310, 312 respectively,which may be flat, contoured, etc. Note that while the term “tapebearing surface” appears to imply that the surface facing the tape 315is in physical contact with the tape bearing surface, this is notnecessarily the case. Rather, only a portion of the tape may be incontact with the tape bearing surface, constantly or intermittently,with other portions of the tape riding (or “flying”) above the tapebearing surface on a layer of air, sometimes referred to as an “airbearing”. The first module 302 will be referred to as the “leading”module as it is the first module encountered by the tape in a threemodule design for tape moving in the indicated direction. The thirdmodule 306 will be referred to as the “trailing” module. The trailingmodule follows the middle module and is the last module seen by the tapein a three module design. The leading and trailing modules 302, 306 arereferred to collectively as outer modules. Also, note that the outermodules 302, 306 will alternate as leading modules, depending on thedirection of travel of the tape 315.

In one embodiment, the tape bearing surfaces 308, 310, 312 of the first,second and third modules 302, 304, 306 lie on about parallel planes(which is meant to include parallel and nearly parallel planes, e.g.,between parallel and tangential as in FIG. 6), and the tape bearingsurface 310 of the second module 304 is above the tape bearing surfaces308, 312 of the first and third modules 302, 306. As described below,this has the effect of creating the desired wrap angle α₂ of the taperelative to the tape bearing surface 310 of the second module 304.

Where the tape bearing surfaces 308, 310, 312 lie along parallel ornearly parallel yet offset planes, intuitively, the tape should peel offof the tape bearing surface 308 of the leading module 302. However, thevacuum created by the skiving edge 318 of the leading module 302 hasbeen found by experimentation to be sufficient to keep the tape adheredto the tape bearing surface 308 of the leading module 302. The trailingedge 320 of the leading module 302 (the end from which the tape leavesthe leading module 302) is the approximate reference point which definesthe wrap angle α₂ over the tape bearing surface 310 of the second module304. The tape stays in close proximity to the tape bearing surface untilclose to the trailing edge 320 of the leading module 302. Accordingly,read and/or write elements 322 may be located near the trailing edges ofthe outer modules 302, 306. These embodiments are particularly adaptedfor write-read-write applications.

A benefit of this and other embodiments described herein is that,because the outer modules 302, 306 are fixed at a determined offset fromthe second module 304, the inner wrap angle α₂ is fixed when the modules302, 304, 306 are coupled together or are otherwise fixed into a head.The inner wrap angle α₂ is approximately tan⁻¹ (δ/W) where δ is theheight difference between the planes of the tape bearing surfaces 308,310 and W is the width between the opposing ends of the tape bearingsurfaces 308, 310. An illustrative inner wrap angle α₂ is in a range ofabout 0.3° to about 1.1°, though can be any angle required by thedesign.

Beneficially, the inner wrap angle α₂ on the side of the module 304receiving the tape (leading edge) will be larger than the inner wrapangle α₃ on the trailing edge, as the tape 315 rides above the trailingmodule 306. This difference is generally beneficial as a smaller α₃tends to oppose what has heretofore been a steeper exiting effectivewrap angle.

Note that the tape bearing surfaces 308, 312 of the outer modules 302,306 are positioned to achieve a negative wrap angle at the trailing edge320 of the leading module 302. This is generally beneficial in helpingto reduce friction due to contact with the trailing edge 320, providedthat proper consideration is given to the location of the crowbar regionthat forms in the tape where it peels off the head. This negative wrapangle also reduces flutter and scrubbing damage to the elements on theleading module 302. Further, at the trailing module 306, the tape 315flies over the tape bearing surface 312 so there is virtually no wear onthe elements when tape is moving in this direction. Particularly, thetape 315 entrains air and so will not significantly ride on the tapebearing surface 312 of the third module 306 (some contact may occur).This is permissible, because the leading module 302 is writing while thetrailing module 306 is idle.

Writing and reading functions are performed by different modules at anygiven time. In one embodiment, the second module 304 includes aplurality of data and optional servo readers 331 and no writers. Thefirst and third modules 302, 306 include a plurality of writers 322 andno data readers, with the exception that the outer modules 302, 306 mayinclude optional servo readers. The servo readers may be used toposition the head during reading and/or writing operations. The servoreader(s) on each module are typically located towards the end of thearray of readers or writers.

By having only readers or side by side writers and servo readers in thegap between the substrate and closure, the gap length can besubstantially reduced. Typical heads have piggybacked readers andwriters, where the writer is formed above each reader. A typical gap is20-35 microns. However, irregularities on the tape may tend to droopinto the gap and create gap erosion. Thus, the smaller the gap is thebetter. The smaller gap enabled herein exhibits fewer wear relatedproblems.

In some embodiments, the second module 304 has a closure, while thefirst and third modules 302, 306 do not have a closure. Where there isno closure, preferably a hard coating is added to the module. Onepreferred coating is diamond-like carbon (DLC).

In the embodiment shown in FIG. 5, the first, second, and third modules302, 304, 306 each have a closure 332, 334, 336, which extends the tapebearing surface of the associated module, thereby effectivelypositioning the read/write elements away from the edge of the tapebearing surface. The closure 332 on the second module 304 can be aceramic closure of a type typically found on tape heads. The closures334, 336 of the first and third modules 302, 306, however, may beshorter than the closure 332 of the second module 304 as measuredparallel to a direction of tape travel over the respective module. Thisenables positioning the modules closer together. One way to produceshorter closures 334, 336 is to lap the standard ceramic closures of thesecond module 304 an additional amount. Another way is to plate ordeposit thin film closures above the elements during thin filmprocessing. For example, a thin film closure of a hard material such asSendust or nickel-iron alloy (e.g., 45/55) can be formed on the module.

With reduced-thickness ceramic or thin film closures 334, 336 or noclosures on the outer modules 302, 306, the write-to-read gap spacingcan be reduced to less than about 1 mm, e.g., about 0.75 mm, or 50% lessthan commonly-used LTO tape head spacing. The open space between themodules 302, 304, 306 can still be set to approximately 0.5 to 0.6 mm,which in some embodiments is ideal for stabilizing tape motion over thesecond module 304.

Depending on tape tension and stiffness, it may be desirable to anglethe tape bearing surfaces of the outer modules relative to the tapebearing surface of the second module. FIG. 6 illustrates an embodimentwhere the modules 302, 304, 306 are in a tangent or nearly tangent(angled) configuration. Particularly, the tape bearing surfaces of theouter modules 302, 306 are about parallel to the tape at the desiredwrap angle α₂ of the second module 304. In other words, the planes ofthe tape bearing surfaces 308, 312 of the outer modules 302, 306 areoriented at about the desired wrap angle α₂ of the tape 315 relative tothe second module 304. The tape will also pop off of the trailing module306 in this embodiment, thereby reducing wear on the elements in thetrailing module 306. These embodiments are particularly useful forwrite-read-write applications. Additional aspects of these embodimentsare similar to those given above.

Typically, the tape wrap angles may be set about midway between theembodiments shown in FIGS. 5 and 6.

FIG. 7 illustrates an embodiment where the modules 302, 304, 306 are inan overwrap configuration. Particularly, the tape bearing surfaces 308,312 of the outer modules 302, 306 are angled slightly more than the tape315 when set at the desired wrap angle α₂ relative to the second module304. In this embodiment, the tape does not pop off of the trailingmodule, allowing it to be used for writing or reading. Accordingly, theleading and middle modules can both perform reading and/or writingfunctions while the trailing module can read any just-written data.Thus, these embodiments are preferred for write-read-write,read-write-read, and write-write-read applications. In the latterembodiments, closures should be wider than the tape canopies forensuring read capability. The wider closures may require a widergap-to-gap separation. Therefore, a preferred embodiment has awrite-read-write configuration, which may use shortened closures thatthus allow closer gap-to-gap separation.

Additional aspects of the embodiments shown in FIGS. 6 and 7 are similarto those given above.

A 32 channel version of a multi-module head 126 may use cables 350having leads on the same or smaller pitch as current 16 channelpiggyback LTO modules, or alternatively the connections on the modulemay be organ-keyboarded for a 50% reduction in cable span. Over-under,writing pair unshielded cables may be used for the writers, which mayhave integrated servo readers.

The outer wrap angles α₁ may be set in the drive, such as by guides ofany type known in the art, such as adjustable rollers, slides, etc. oralternatively by outriggers, which are integral to the head. Forexample, rollers having an offset axis may be used to set the wrapangles. The offset axis creates an orbital arc of rotation, allowingprecise alignment of the wrap angle α₁.

To assemble any of the embodiments described above, conventional u-beamassembly can be used. Accordingly, the mass of the resultant head may bemaintained or even reduced relative to heads of previous generations. Inother approaches, the modules may be constructed as a unitary body.Those skilled in the art, armed with the present teachings, willappreciate that other known methods of manufacturing such heads may beadapted for use in constructing such heads. Moreover, unless otherwisespecified, processes and materials of types known in the art may beadapted for use in various embodiments in conformance with the teachingsherein, as would become apparent to one skilled in the art upon readingthe present disclosure.

Read transducers benefit from reduced head-tape spacing, which in turntranslates into increased aerial density. In addition, protectivecoatings on the read transducers are critical for shielding the sensorsfrom corrosion due to harsh environments, shorting due to smearing, andwear due to abrasive media. Conventional methods of applying aprotective layer include coating uniformly the entire surface of thehead. These methods and resulting protected heads provide durability ofthe heads but the extensive coating on the head may create magneticspacing loss that may contribute to degradation of performance. Thus,efficient coating of the sensor may improve resolution of the readtransducers.

FIG. 8 depicts an apparatus 800, in accordance with one embodiment. Asan option, the present apparatus 800 may be implemented in conjunctionwith features from any other embodiment listed herein, such as thosedescribed with reference to the other FIGS. Of course, however,apparatus 800 and others presented herein may be used in variousapplications and/or in permutations which may or may not be specificallydescribed in the illustrative embodiments listed herein. Further, theapparatus 800 presented herein may be used in any desired environment.

Apparatus 800 includes a module 802 that has a magnetic read transducer803. Although FIG. 8 illustrates only a single magnetic read transducer803, apparatus 800 may include one or more additional magnetic readtransducers on a remainder of the module 802, e.g., in an array such asin FIGS. 2B-4. Accordingly, the components and/or configurations ofmagnetic read transducer 803 may be incorporated in any apparatusdescribed herein.

According to some embodiments, the read transducer 803 may be configuredas a data sensor for reading data tracks of a magnetic medium. Accordingto other embodiments, the read transducer 803 may be configured as aservo sensor for reading servo tracks of a magnetic medium.

The magnetic read transducer 803 includes magnetic shields 806, 808 onopposite sides of a sensor 804 (e.g. such as a TMR sensor, GMR sensor,etc.) in an intended direction 812 of media travel thereacross. Theupper shield 808 may be positioned above the lower shield 806 (e.g., ina deposition direction thereof). As would be appreciated by one skilledin the art, upper and lower shields 806, 808 preferably provide magneticshielding for the sensor 804. Thus, one or both of the upper and lowershields 806, 808 may desirably include a magnetic material of a typeknown in the art, for example, permalloy, e.g., a ferromagnetic alloy ofnickel and iron.

An apparatus having a module 802 according to one embodiment may have awear-resistant in-situ film 810 on the read transducer 803. The in-situfilm 810 is preferably more wear-resistant than permalloy due to thein-situ film having one or more of the following characteristics: higherhardness than permalloy, lower ductility than permalloy, and higherYoung's modulus (modulus of elasticity) than permalloy. Note thatpermalloy may or may not be present in the thin films of the reader, butis a typical component in many embodiments. The apparatus according tovarious approaches may be configured as described herein, and/or in anyconventional configuration. Referring to FIG. 8, an apparatus 800 havinga gap 218 is shown according to one embodiment. The substrate 204A andclosure 204B may form portions of a media bearing surface 836, and mayfurther define a thin film region which may include multiple thin filmswhich may reside in a gap, such as gap 218 shown in FIG. 8. The gap 218may include an array of transducers, including anisotropicmagnetoresistive (AMR), giant magnetoresistive (GMR), tunnelingmagnetoresistive (TMR), or colossal magnetoresistive (CMR) sensorsand/or writers, each separated by sufficient insulator layers, shieldlayers, and/or pole layers so that the array of transducers may functionas readers and/or writers in read or write operations when used in amagnetic head. Moreover, any of the sensors may have a current-in-plane(CIP) or current-perpendicular-to-plane (CPP) configuration. Thesubstrate and transducers, if not recessed relative to the substrate,may form portions of a planar tape media bearing surface 836.

In an exemplary embodiment as shown in FIG. 8, an apparatus 800 includesa magnetic read transducer 803 having a sensor 804 flanked by shields806, 808 and may include a wear-resistant in-situ film 810 on amedia-facing side 834 of the read transducer 803. The in-situ film 810may include deposits of material from a flexible medium that travels inthe direction 812 of media travel across the tape bearing surface. Inaddition, the in-situ film 810 may be primarily (>50 vol %) above theread transducer 803. For example, greater than 80% of the volume of thein-situ film 810 may be positioned above the read transducer 803. Insome approaches, the in-situ film 810 may be primarily above the sensor804 itself.

Furthermore, the in-situ film may extend along the media-facing side 834beyond at least one of the shields 806, 808 in an intended direction 812of media travel thereacross. In one approach, the in-situ film 810 mayextend along the media-facing side 834 beyond both shields 806, 808 inan intended direction 812 of media travel thereacross. In someapproaches (not shown), the in-situ film may extend all the way withinthe gap between the substrate and the closure. However, in a preferredapproach, the in-situ film 810 does not extend along the media-facingside 834 beyond the shields 806, 808, e.g., as shown in FIG. 8.

FIG. 9 depicts an apparatus 900, in accordance with one embodiment. Asan option, the present apparatus 900 may be implemented in conjunctionwith features from any other embodiment listed herein, such as thosedescribed with reference to the other FIGS. Of course, however,apparatus 900 and others presented herein may be used in variousapplications and/or in permutations which may or may not be specificallydescribed in the illustrative embodiments listed herein. Further, theapparatus 900 presented herein may be used in any desired environment.

In one embodiment, as depicted in FIG. 9, the apparatus 900 has a module902 that includes a transducer 803 that may have an in-situ film 810extending along the media-facing side 834 of a sensor 804. Moreover, inthe embodiment shown in FIG. 9, the in-situ film 810 may about to theshields 806, 808 in an intended direction 812 of media travelthereacross. In another embodiment, the in-situ film 810 may not extendbeyond the region between the shields 806, 808 in an intended direction812 of media travel thereacross.

As mentioned above, in various embodiments, the read transducer 803 maybe one of an array of read transducers where the in-situ film 810 may beon media-facing sides 834 of the read transducers 803.

The in-situ film 810 may include material from a flexible medium thattravels across the read transducer 803 in the direction 812 of mediatravel. The flexible medium may be a tape in some embodiments. Invarious approaches, the flexible medium may be a magnetic tape.

In various embodiments, e.g., such as those shown in FIGS. 8 and 9, thein-situ film 810 may include iron oxide. In other approaches, thein-situ film 810 may include the wear-resistant material, along with alubricant and/or other components of flexible medium that travels acrossthe transducer 803.

In various embodiments, the transducer 803 may have a first coating 832(FIG. 10) of conventional protective material above the transducer 803that provides a uniform coating on the entire surface 836 of the module,or in the gap 218, and an in-situ film 810 thereabove.

FIG. 10 depicts an apparatus 1000, in accordance with one embodiment. Asan option, the present apparatus 1000 may be implemented in conjunctionwith features from any other embodiment listed herein, such as thosedescribed with reference to the other FIGS. Of course, however,apparatus 1000 and others presented herein may be used in variousapplications and/or in permutations which may or may not be specificallydescribed in the illustrative embodiments listed herein. Further, theapparatus 1000 presented herein may be used in any desired environment.

According to one embodiment as shown in FIG. 10, the apparatus 1000includes a read transducer 803 that may have an alumina coating 832 onand extending along the media-facing side 834 of the read transducer 803where the in-situ film 810 may be above the alumina coating 832. In someapproaches, the in-situ film 810 above the alumina coating 832 mayextend no further than the shields 806, 808 on opposite sides of theread transducer 803, e.g., may extend about to the shield as shown inFIG. 9. In other approaches, the in-situ film 810 above the aluminacoating 832 may extend above the shields 806, 808 (not shown). In yetanother approach, the in-situ film 810 above the alumina coating 832 mayextend beyond the shields 806, 808 within the gap 218 between thesubstrate 204A and closure 204B (not shown).

As shown in each embodiment of FIGS. 8, 9 and 10, the read transducer803 may be positioned between a substrate 204A and a closure 204B wherea media-facing side 834 of the closure 204B and a media-facing side 834of the substrate 204A may extend along a common plane (for example, thetape bearing surface 836). In addition, the media-facing side 834 of theread transducer 803 may be recessed by a distance x from a planeextending along the media-facing side 834 of the substrate 204A suchthat the in-situ film 810 may have a thickness above the read transducer803 that may not be greater than the distance x of recession from theplane extending along the media-facing side 834 of the substrate 204A.In some approaches, the illustrative thickness of coating 810 may beleast a quarter of the distance (0.25x). In other approaches, thethickness of the coating 810 may be at least half the distance (0.50x).In yet other approaches, the thickness of the coating 810 may be anydistance up to x.

In an exemplary embodiment, the in-situ film 810 may have a thickness ofat least 5 nm.

FIG. 11 depicts a method 1100 for forming an in-situ film, in accordancewith one embodiment. As an option, the present method 1100 may beimplemented in conjunction with features from any other embodimentlisted herein, such as those described with reference to the other FIGS.Of course, however, method 1100 and others presented herein may be usedin various applications and/or in permutations which may or may not bespecifically described in the illustrative embodiments listed herein.Further, the method 1100 presented herein may be used in any desiredenvironment.

According to one embodiment as shown in FIG. 11, a method 1100 includesoperation 1102 in which the read transducer is heated to above a normaloperating temperature. In operation 1104, an in-situ film is formed onthe magnetic read transducer having a sensor by passing a flexiblemedium over the transducer at the elevated temperature, where thein-situ film may include material from the flexible medium.

In an exemplary embodiment of method 1100, the material may be formed onthe transducer at a temperature that is at least 5° C. above the highestnormal reading temperature for the head under normal operatingconditions. The normal operating conditions and/or normal operatingtemperature may correspond to temperature guidelines provided by themanufacturer of the apparatus in which the transducer resides.

In preferred approaches, the level of the current applied to the readtransducer may be greater than a normal operation current level usedwhen the magnetic structure is operating for its intended use such thatthe normal reading temperature of the transducer is raised by at least5° C. by joule heating.

In some approaches of the method 1100, the material may be formed on thetransducer when the temperature of the read transducer is above a glasstransition temperature of the medium, for example at a temperature whenthe binder of the flexible medium becomes transportable.

According to one embodiment of method 1100, the material may be formedonly on a media-facing side of the read transducer relative to the restof the module. In some approaches of method 1100, the material mayextend along the media-facing side beyond at least one of the shields inan intended direction of media travel thereacross.

In a tape drive, current may be applied directly to each individual readsensor. The method 1100 may involve applying current to generate heatlocal to the sensor area. Since the power increases as a square of thecurrent (P=I²R), the heating also increases roughly by the square of thecurrent. The in-situ film on the surface of the flexible medium issensitive to heat. According to an exemplary embodiment of method 1100,a bias current may be run at a higher value than operating current toelevate the temperature of the read transducer. The optimal current toelevate the temperature of the read transducer may be relative to aparticular head having a certain stripe height, track width,resistivity, etc.

FIGS. 12A-12B are atomic-force microscopy (AFM) images that show thetopography of a transducer run at a current of 5 mA which is above thetypical operating current of 3 mA for this particular magnetic head.FIG. 12A shows the Closure and Substrate with the shields, S1 and S2,and the Sensor. At a bias current of 5 mA, the in-situ film start toform on the Sensor. The graph below FIG. 12A shows the relativetopography height of the areas. The recession at shield 2 (S2) and thearea near the closure (OC) is at 12.3 nm and 14.2 nm respectivelywhereas the recession at the sensor (MR) is only 2.2 nm, thus thereduction of recession indicates the formation of material at thesensor.

FIG. 12B is a magnified AFM image of the in-situ film forming on thesensor when the transducer is run at a current of 5 mA. The in-situ filmappears to extend along the media facing surface to the edge of theshields (S1 and S2).

FIGS. 13A-13B are two magnifications of AFM images that show thetopography of a transducer run at a current of 7 mA. At the higher biascurrent of 7 mA, a thick layer of material forms and over the entiresensor and parts of the shields and the hard bias. The higher thetemperature, the more the material builds up on the surface and forms aprotective cap over the sensor.

From experimental observation, the abrasivity of magnetic recording tapeis unable to remove the in-situ film, and over time the in-situ filmbecomes very resistant to wear by the magnetic recording tape. Thismaterial is fairly wear-resistant even in cold and wet environments. Insome approaches, if the in-situ film wears away during extensive driveuse, the method 1100 may be repeated in the field to generate a new filmor replenish the film.

The in-situ film that forms on the sensor may be primarily comprised ofmagnetic particles fragments and tape lubrication from the flexiblemedium passing over the transducer. According to one embodiment ofmethod 1100, the material formed on the transducer may include ironoxide.

The thickness of the in-situ film can be adjusted by adjusting thetemperature, the length of medium running over time and/or type ofmedium used to form the in-situ film.

In one embodiment of method 1100, a media-facing side of the transducermay be recessed from a plane of a tape bearing surface of a substrateupon which the transducer is formed. Moreover, the material may beformed on the media-facing side of the transducer until the in-situ filmhas a desired thickness, e.g., extending up to the plane. In someapproaches, the in-situ film may have a thickness of at least 5 nm.

In conventional tape heads, an alumina coating may be present on themedia facing surface of the transducer and the areas thereabout toprotect the tape head from degradation. In one embodiment of method1100, the material may be formed above an alumina coating on the readtransducer. In other approaches, the sensor can be masked duringmanufacture so that the alumina coating is only present on thenon-sensor surfaces of the tape head. Then the in-situ film describedherein may be formed directly on the sensor that does not have aluminacoating by raising the temperature of the transducer while running aflexible medium over the media facing surface of the transducer.

In use, an in-situ film may be added to magnetic read transducers in thefield using the methodology described herein. Using either aconventional magnetic data tape medium or a special tape designed tocreate a primarily iron oxide in-situ film, the tape could be run overan array of transducers. The current for an array of transducers, orsingle transducers, may be adjusted to a bias current that raises thetemperature of the transducer at least 5° C. above the operatingtemperature of the transducer to form an in-situ film on the heatedtransducer. Thereafter, the bias current may be lowered to operatingtemperature to perform the read function of the transducer.

FIG. 14 depicts a method 1400 for forming an in-situ film, in accordancewith one embodiment. As an option, the present method 1400 may beimplemented in conjunction with features from any other embodimentlisted herein, such as those described with reference to the other FIGS.Of course, however, method 1400 and others presented herein may be usedin various applications and/or in permutations which may or may not bespecifically described in the illustrative embodiments listed herein.Further, the method 1100 presented herein may be used in any desiredenvironment.

In method 1400, resistances are used to determine if a protectivecoating thereon has been worn off or depleted, and if so, an in-situfilm is formed. The method may be performed by the drive directly, by acomputer passing instructions to the drive, by a user controlling thetape drive, etc.

In operation 1402, resistances of read transducers are measured. Anyknown technique may be used. For example, the controller of the drivemay pass a read current through the sensor and measure the resistance ofthe sensor.

When the coating is depleted, the sensor tends to wear, which in turnincreases resistance thereacross. Accordingly, in operation 1404, themeasured resistances are compared to previously stored resistancevalues, which may be retrieved from a table, from memory, etc. Thecomparison may be on a per-read-transducer basis, using averages of thepast and present resistance values, etc.

In operation 1406, in response to determining that the measuredresistances have not significantly changed from the previously storedresistance values, e.g., are within 10% of the previously stored valuesor within some predefined range, the drive returns to normal operation.

In response to determining that the measured resistances havesignificantly changed from the previously stored resistance values, anin-situ film may be formed and/or replenished via operation 1408 whichincludes heating the read transducers above a normal operationtemperature, and operation 1410 which includes running a flexible mediumover the transducers for forming an in-situ film thereon. Then operation1412 returns the transducers to normal operating currents andtemperatures and the method 1400 returns to operation 1406.

In a preferred embodiment of a magnetic tape designed for presentlydisclosed techniques of forming the in-situ film, the flexible mediummay be a tape where the concentration of lubricant is increased and thewear particles may be reduced relative to conventional data tapes.

In other uses, if a drive is in a library, the in-situ film may beapplied in an off-line operation. The in-situ film may be applied untilthe readback signal shows that the spacing compares to the spacing ofthe head at time zero or at some point in transition.

The present invention may be a system, a method, and/or a computerprogram product. The computer program product may include a computerreadable storage medium (or media) having computer readable programinstructions thereon for causing a processor to carry out aspects of thepresent invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of one or more programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions may execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer may be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection may be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) may execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general-purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the block may occur out of theorder noted in the figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

Moreover, a system according to various embodiments may include aprocessor and logic integrated with and/or executable by the processor,the logic being configured to perform one or more of the process stepsrecited herein. By integrated with, what is meant is that the processorhas logic embedded therewith as hardware logic, such as an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), etc. By executable by the processor, what is meant is that thelogic is hardware logic; software logic such as firmware, part of anoperating system, part of an application program; etc., or somecombination of hardware and software logic that is accessible by theprocessor and configured to cause the processor to perform somefunctionality upon execution by the processor. Software logic may bestored on local and/or remote memory of any memory type, as known in theart. Any processor known in the art may be used, such as a softwareprocessor module and/or a hardware processor such as an ASIC, a FPGA, acentral processing unit (CPU), an integrated circuit (IC), etc.

It will be clear that the various features of the foregoing systemsand/or methodologies may be combined in any way, creating a plurality ofcombinations from the descriptions presented above.

It will be further appreciated that embodiments of the present inventionmay be provided in the form of a service deployed on behalf of acustomer.

The inventive concepts disclosed herein have been presented by way ofexample to illustrate the myriad features thereof in a plurality ofillustrative scenarios, embodiments, and/or implementations. It shouldbe appreciated that the concepts generally disclosed are to beconsidered as modular, and may be implemented in any combination,permutation, or synthesis thereof. In addition, any modification,alteration, or equivalent of the presently disclosed features,functions, and concepts that would be appreciated by a person havingordinary skill in the art upon reading the instant descriptions shouldalso be considered within the scope of this disclosure.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. Thus, the breadth and scope of an embodiment of the presentinvention should not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

What is claimed is:
 1. An apparatus, comprising: a magnetic readtransducer having a sensor comprised of a sensing portion and proximatemagnetic shields; and an in-situ film on a media-facing side of the readtransducer, wherein the in-situ film is comprised of material from aflexible medium, wherein the in-situ film is primarily above the readtransducer, wherein the in-situ film is wear-resistant, wherein thein-situ film includes iron oxide.
 2. An apparatus as recited in claim 1,wherein the in-situ film extends along the media-facing side beyond atleast one of the shields in an intended direction of media travelthereacross.
 3. An apparatus as recited in claim 1, wherein the in-situfilm extends along the media-facing side no further than the shields inan intended direction of media travel thereacross.
 4. An apparatus asrecited in claim 1, wherein the read transducer is one of an array ofread transducers, wherein the in-situ film is on media-facing sides ofthe read transducers.
 5. An apparatus as recited in claim 1, comprisingan alumina coating on the media-facing side of the read transducer,wherein the in-situ film is above the alumina coating.
 6. An apparatusas recited in claim 1, wherein the read transducer is positioned betweena substrate and a closure; wherein the media-facing side of the readtransducer is recessed from a plane extending along the media-facingside of the substrate; and the in-situ film having a thickness above theread transducer not greater than the distance of recession from theplane extending along the media-facing side of the substrate.
 7. Anapparatus as recited in claim 1, wherein the in-situ film has athickness of at least 5 nm.
 8. An apparatus as recited in claim 1,further comprising: a drive mechanism for passing a flexible medium overthe transducer; and a controller electrically coupled to the transducer.9. An apparatus as recited in claim 1, comprising an alumina coating ona media-facing side of a module having the read transducer, wherein thein-situ film is above the read transducer, wherein the alumina coatingis not present between the read transducer and the in-situ film.
 10. Anapparatus, comprising, a magnetic read transducer having a sensorcomprised of a sensing portion and proximate magnetic shields; anin-situ film on a media-facing side of the read transducer, wherein thein-situ film is comprised of material from a flexible medium, whereinthe in-situ film is primarily above the read transducer, wherein thein-situ film is wear-resistant; and an alumina coating on a media-facingside of a module having the read transducer, wherein the in-situ film isabove the read transducer, wherein the alumina coating is not presentbetween the read transducer and the in-situ film.
 11. An apparatus asrecited in claim 10, wherein the in-situ film extends along themedia-facing side beyond at least one of the shields in an intendeddirection of media travel thereacross.
 12. An apparatus as recited inclaim 10, wherein the in-situ film extends along the media-facing sideno further than the shields in an intended direction of media travelthereacross.
 13. An apparatus as recited in claim 10, wherein the readtransducer is one of an array of read transducers, wherein the in-situfilm is on media-facing sides of the read transducers.
 14. An apparatusas recited in claim 10, wherein the in-situ film includes iron oxide.15. An apparatus as recited in claim 10, comprising an alumina coatingon the media-facing side of the read transducer, wherein the in-situfilm is above the alumina coating.
 16. An apparatus as recited in claim10, wherein the read transducer is positioned between a substrate and aclosure; wherein the media-facing side of the read transducer isrecessed from a plane extending along the media-facing side of thesubstrate; and the in-situ film having a thickness above the readtransducer not greater than the distance of recession from the planeextending along the media-facing side of the substrate.
 17. An apparatusas recited in claim 10, wherein the in-situ film has a thickness of atleast 5 nm.
 18. An apparatus as recited in claim 10, further comprising:a drive mechanism for passing a flexible medium over the transducer; anda controller electrically coupled to the transducer.